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Product Details
✓Diamond flux FN231. Class ROL0 NoClean. Suitable for Soldering of Lead and Lead-Free Alloys. Perfect Wettability of Soldered Surfaces.
✓Low Activity Soldering Flux for Not Highly Oxidized Surfaces, Components and PCBs. Ideal for Repairing and Soldering Electronic Components onto Clean Printed Circuit Boards.
✓For Soldering and Repairing FPGA, BGA, QFN, QFP, SOIC and other Cases of Microcircuits. For Any SMD and DIP Components.
✓Soldering Flux for Critical Printed Circuit Boards, Where Neutrality and Passivity of Indelible Flux Residues are Required. Solder Flux Residue not Conducting, not Corrosive. Conforms to Standard J-STD-004B and ROHS.
✓Soldering Flux Residues Can Be Easily Cleaned Off with PCB Cleaner for Electronic Printed Circuit Boards if Necessary.
✓The shelf life is 2 years from the date of manufacture indicated on the Syringe Sticker, including the 2024 batches.