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Product Details
✓Lead-Free Solder Paste Content: Alloy Tin 64.7% Bi35% Ag0.3%, Solder Flux Content: 10.5%
✓Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
✓Paste Features: Lead-Free, No Clean, Strong Viscosity, Bright Welding Point
✓Paste Features: Lead-Free Solder Paste - Low Temperature Solder Paste With Flux, Melting Point: 183°C,Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, SpecialWelding Of Small Components.
✓Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance